Thick Film Hybrid Integrated Circuit

Product Details
Customization: Available
Transport Package: Plastic Vacuum Bag
Specification: customized
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  • Thick Film Hybrid Integrated Circuit
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Basic Info.

Trademark
FDS
Origin
China
HS Code
8534009000
Production Capacity
1, 000, 000

Product Description

Thick film circuit boards Brief Introduction:
What is Thick-film technology ?
Thick-film technology is used to produce electronic devices such as resistor card, surface mount deviceshybrid integrated circuits and sensors by silk  precision printing technology and following process drying/curing, firing, and laser trimming of resistors. Now thick film circuits are been widely applied to automotive industry, power tool circuits, LED lighting industry etc.
Applications & materials:
Application Substrate Conductor ink Resistor ink Dielectric layer ink Capacitors & semiconductors
Vehicle's fuel level sensor resistor card Al2O396% PdAg, PdAu Ruthenium glass Available
Vehicle's TPS card Al2O3 96%   Ruthenium glass Available
Air, pressure sensor Al2O3 96% PdAg Ruthenium glass Available
Power tool  switch Al2O3 96%   Carbon   Available
Automotive HVAC actuator FR-4   Carbon   Available
TPS FR-4   Carbon   Available
Automotive head light regulator FR-4   Carbon   Available
Game handle circuit FR-4   Carbon   Available
Power tool  switch FR-4   Carbon   Available
Thick Film Hybrid Integrated Circuit

Physical features: (
Al2O3 96% substrate):

Working Tem. Range:
-40ºC~+125ºC
Conductor ink Adhesion force: >105N  (Ag/Pd)
Wearing resistance cycle:
Friction life cycle in air:
Max 2million times
Friction life cycle in fuel:
Max 5 million times

Resistor ink: Ruthenium
  Stable resistance,
Resistance trimming precision
Minimum 2‰
 
Printing precision:
Minimum line space 0.15 mm,
Minimum line width 0.15mm
Corrosion resistance:
Working In Lead-free Gasoline,
Diesel,E20, M15,etc.

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